High TG 180 Material Multilayer HDI Circuit Board PCB manufacturer
Quick Details
Board Thickness:0.4mm-8.5mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm
Min. Line Spacing:0.1mm
Surface Finishing:HASL,HAL-LF,OSP ENIG etc
Min inner Layer Clearance::0.1mm
PCBA business:OEM&ODM servise
multi-layer:1-22 layers for your choose
Silkscreen color:white black red yellow
Solder mask color:green,red,black,blue,white,etc
Warp and Twist:≤0.7%
Place of Origin:Guangdong, China (Mainland)
Brand Name: ONESEINE PCB
Base Material: Isola FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum
Copper Thickness:1-6OZ
High Tg PCB General Information:
Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
Also there're a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.
170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you'd better use Ceramic boardwhich can go through -55~880C.
Please contact us for more information about Hi Tg circuit board.
High Tg materials have the following properties:
· High glass flow temperature value (Tg)
· High temperature durability
· Long delamination durability
· Low Z axis expansion (CTE)
High TG pcb Application:
petrochemical industry,Mine industry
Industrial equipment, GPS, automotive, instrumentation, medical equipment, aircraft, military weapons, missiles, satellites
DC-DC Power Converters,Automotive,Electronics ,High Brightness LED,Power Supply circuit
What is High TG pcb?
In recent years, the demand for the production of high-Tg printed circuit board increased year by year. The following describes the high Tg circuit board in the end what is.
High Tg refers to high heat resistance. General Tg of the plate is more than 130 degrees, high Tg is generally greater than 170 degrees, medium Tg is greater than about 150 degrees, usually Tg ≥ 170 ℃ PCB, called high Tg printed circuit board. With the leap in the development of the electronics industry, especially the computer as the representative of the electronic products, toward a high functional, high multi-layer development, the need for PCB substrate materials, higher heat resistance as an important guarantee. The emergence and development of high-density mounting technology, represented by SMT and CMT, have made PCBs more and more dependent on the high heat resistance of the substrate in terms of small aperture, fine wiring and thinness.
The Tg of the substrate is improved, and the characteristics of heat resistance, moisture resistance, chemical resistance, and stability of the printed circuit board are improved and improved. The higher the TG value, the better the temperature resistance of the sheet, especially in the lead-free process, high Tg applications.
Therefore, the general FR-4 and the high Tg of the FR-4 difference is: in the hot state, especially in the moisture after heating, the material's mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition , Thermal expansion and other conditions there are differences in high-Tg products significantly better than ordinary PCB substrate material.
High TG pcb Features:
Excellent heat dissipation, 3-4 times
better than normal FR-4
Excellent thermal and insulation reliability
Superior processability and low Z-CTE
A high TG (glass transition) PCB, also known as a high-temperature PCB, is a type of printed circuit board designed to withstand elevated temperatures.
The glass transition temperature refers to the temperature at which the resin material used in a PCB transitions from a solid, rigid state to a more flexible or rubbery state. Standard PCBs typically have a glass transition temperature of around 130-140°C. However, high TG PCBs are engineered to have a higher glass transition temperature, usually ranging from 150°C to 180°C or even higher.
The higher TG value of the PCB material allows it to withstand increased heat without undergoing significant dimensional changes or loss of mechanical integrity. This makes high TG PCBs suitable for applications that involve high-temperature environments, such as power electronics, automotive electronics, aerospace systems, and industrial equipment.
High TG PCBs are usually constructed using specialized laminates with thermally stable resin systems, such as FR-4 with a higher TG rating or other advanced materials like polyimide (PI) or ceramic-filled laminates. These materials exhibit better thermal stability, lower coefficient of thermal expansion (CTE), and improved mechanical strength compared to standard PCB materials.
The manufacturing process for high TG PCBs involves specific techniques to ensure proper bonding and adhesion of copper traces, vias, and other components to withstand the higher temperatures during assembly and operation. This may include using controlled heating and cooling profiles during lamination, improved copper plating techniques, and ensuring appropriate solder mask materials and processes.
Overall, high TG PCBs offer enhanced heat resistance and reliability, making them suitable for demanding applications where exposure to elevated temperatures is a concern.
